High Frequency PCB Manufacturer
Custom high frequency PCB manufacturing for RF, microwave, antenna, radar, 5G communication, and high-speed electronic applications.
Key point: High frequency PCB uses Rogers, PTFE, Taconic or F4B laminate materials with low dissipation factor (Df) and stable dielectric constant (Dk) for RF and microwave circuits above 500 MHz. Rogers RO4350B (Df 0.0037) is standard for 1–12 GHz. Rogers RO3003 (Df 0.0010, PTFE) is required for Ka-band and 77 GHz. Rogers RT5880 (Df 0.0009, PTFE) is standard for wideband EW 2–18 GHz. All PTFE materials require in-house plasma activation. Riching PCB is a direct factory in Shenzhen with full Rogers and PTFE capability, no MOQ, 5–7 day prototype lead time.
Custom High Frequency PCB for RF and Microwave Applications
Riching PCB provides custom high frequency PCB manufacturing for RF, microwave, antenna, radar, 5G communication, and high-speed electronic applications. We support Rogers, PTFE, Taconic, F4B and hybrid stackup materials with controlled impedance, 2–36 layers, and min trace width 2.5mil.
High Frequency PCB Manufacturing with Engineering Review
High frequency PCB projects require stable dielectric performance, low signal loss, accurate impedance control, reliable copper plating, and careful stackup design. We support prototype, small-batch, and batch production based on Gerber files, stackup requirements, material specifications, copper thickness, surface finish, and application needs.
Our manufacturing capability covers board thickness 0.1–10mm, copper thickness 0.5oz–5oz, minimum drill diameter 0.1mm, hole tolerance ±0.05mm, and impedance control ±10%. Whether your project requires Rogers, PTFE, Taconic, F4B, or FR4 hybrid stackups, our team reviews your design requirements before production.
Key Manufacturing Specs
- Layers: 2–36 layers
- Min trace / space: 2.5mil / 3mil
- Min drill diameter: 0.1mm
- Impedance control: ±10%
- Board thickness: 0.1–10mm
- Copper thickness: 0.5oz–5oz
- Surface finish: ENIG, HASL, OSP, immersion silver, immersion tin
- Prototype and batch production supported
High Frequency PCB Materials We Support
Material selection is critical for RF and microwave PCB performance. Different applications may require different dielectric constant, loss tangent, thickness, thermal performance, and stackup structure.
Rogers Materials
RO4000 series, RT/duroid series and other Rogers laminates for RF, microwave, antenna, radar, and communication PCB projects.
PTFE Laminates
Low-loss PTFE materials for microwave circuits, RF modules, antenna systems, and high-frequency electronic devices.
Taconic Materials
Commonly used for RF and microwave PCB projects requiring low dielectric loss and stable signal performance.
F4B Materials
A practical option for RF and microwave PCB projects with balanced performance, availability, and production efficiency.
FR4 + High Frequency Hybrid Stackups
Hybrid stackups combine FR4 and high-frequency materials to balance cost, mechanical structure, and electrical performance.
Other High Frequency Materials
We can also review material requirements based on customer specifications, working frequency, and application environment.
Manufacturing Capabilities for High Frequency PCB Projects
High frequency PCB manufacturing requires careful control of materials, drilling, lamination, copper plating, impedance, surface finish, and final inspection. Our production support covers both standard and complex RF/microwave PCB requirements.
Controlled Impedance
Impedance control for RF transmission lines, microwave circuits, antenna PCB designs, and high-speed signal applications.
Low-Loss Material Processing
Processing support for Rogers, PTFE, Taconic, F4B, FR4 hybrid, and other high-frequency PCB materials.
Multilayer Lamination
Multilayer high frequency PCB manufacturing for complex stackups and mixed-material structures.
Stable Plated Through Holes
Reliable hole wall plating and copper deposition for multilayer and high-frequency circuit boards.
Tight Tolerance Drilling
Precision drilling for vias, plated through holes, RF structures, and compact PCB layouts.
Surface Finish Options
ENIG, immersion silver, immersion tin, HASL, OSP, gold plating, and other surface finish options according to project requirements.
Prototype and Batch Production
Support for prototype testing, small-batch production, and repeat production orders.
Engineering Review Before Production
Gerber files, stackup, material requirements, drill files, impedance notes, and special process requirements can be reviewed before manufacturing.
Technical Capabilities for High Frequency PCB
Key manufacturing parameters for high frequency PCB fabrication. Specific requirements can be confirmed based on your Gerber files, stackup, material, and application needs.
| Item | Capability |
|---|---|
| PCB Type | High frequency PCB, RF PCB, microwave PCB, antenna PCB, radar PCB |
| Materials | Rogers (RO4350B, RO4003C, RO3003, RT5880, RO6010), PTFE, Taconic (TLY-5, RF-35, CER-10), F4B, FR4 hybrid stackup |
| Layers | 2–36 layers; hybrid and complex stackups supported with engineering review |
| Board Thickness | 0.1–10.0mm; standard and custom thickness available based on material and stackup |
| Copper Thickness | 0.5oz–5oz finished copper; inner and outer layer copper customized per design |
| Min Trace / Space | 2.5mil / 3mil (advanced); 3mil / 4mil (standard) |
| Min Drill Diameter | 0.1mm mechanical drill; hole tolerance ±0.05mm |
| Aspect Ratio | Up to 14:1 |
| Impedance Control | ±10% standard; ±5Ω for values below 50Ω; verified by impedance testing and cross-section inspection |
| Hole Copper Plating | 20–50μm copper thickness in plated through holes |
| Surface Finish | ENIG (gold 1–5μ″, nickel ≥120μ″), HASL, immersion silver, immersion tin, OSP, electroplated gold, gold fingers |
| Max Board Size | 480 × 800mm finished board |
| Production Type | Prototype, small batch, and volume production |
| Quality Inspection | AOI, electrical testing, impedance testing, cross-section inspection, material verification, final review |
Typical Applications of High Frequency PCB
High frequency PCBs are widely used in applications where signal integrity, low transmission loss, impedance control, and stable dielectric performance are important.
Quality Control for High Frequency PCB Manufacturing
High frequency PCB production requires more than standard PCB fabrication. Material stability, impedance accuracy, plated through-hole reliability, copper bonding, surface finish, and final inspection all affect the performance of RF and microwave circuits.
Before production, we review Gerber files, stackup structure, material requirements, copper thickness, surface finish, and special notes. Impedance is verified by cross-section inspection and impedance testing. Hole wall copper thickness (20–50μm) and copper bonding are checked before shipment. Every board goes through electrical testing and AOI inspection as standard steps.
High Frequency PCB FAQ
Common questions about high frequency PCB materials, manufacturing, impedance control, prototype support, and quotation requirements.
What is a high frequency PCB?
A high frequency PCB is a printed circuit board designed for RF, microwave, antenna, radar, 5G communication, and high-speed signal applications. Unlike standard FR4 boards, high frequency PCBs use low-loss materials such as Rogers, PTFE, Taconic or F4B with stable dielectric constant (Dk) and low dissipation factor (Df) to minimize signal loss and maintain impedance consistency at high frequencies.
What materials are commonly used for high frequency PCB?
Common materials include Rogers (RO4350B, RO4003C, RO3003, RT5880), PTFE laminates, Taconic (TLY-5, RF-35, CER-10), and F4B series. Rogers RO4350B (Dk 3.48, Df 0.0037) is widely used for 5G and antenna applications. RT5880 (Dk 2.2, Df 0.0009) suits ultra-low-loss radar and aerospace designs. Material choice depends on working frequency, signal loss requirement, dielectric constant, stackup design, and cost.
What is the difference between Rogers and PTFE PCB?
Rogers laminates like RO4350B are hydrocarbon-based and process similarly to standard FR4, making them easier to fabricate and more cost-effective for most RF applications. PTFE-based materials (including Rogers RT/duroid and Taconic TLY series) offer lower Df (as low as 0.0009) and better performance at very high frequencies, but require specialized processing for drilling and copper bonding. For most 5G, antenna and radar applications, Rogers RO4000 series is the preferred choice. PTFE is typically chosen for aerospace, satellite and mmWave applications above 30GHz.
Can you manufacture Rogers high frequency PCB?
Yes. We support Rogers PCB manufacturing including RO4350B, RO4003C, RO3003, RT5880, RT5870 and RO6010. These cover Dk values from 2.2 to 10.2 for different frequency and application requirements. Send your Gerber files, stackup and material requirements for engineering review before production.
Do you support controlled impedance for high frequency PCB?
Yes. We support impedance control with tolerance ±10% standard and ±5Ω for values below 50Ω. Impedance is verified by cross-section inspection and impedance testing before delivery. Please include your impedance requirements, target values, reference layers and trace dimensions when sending PCB files for review.
What are your minimum trace width and drill diameter?
Minimum trace width and spacing is 2.5mil/3mil for advanced capability and 3mil/4mil for standard production. Minimum mechanical drill diameter is 0.1mm with hole tolerance ±0.05mm. Aspect ratio supports up to 14:1. These parameters may vary depending on the material, copper thickness and stackup design.
Do you support prototype production?
Yes. We support prototype, small-batch, and volume production for high frequency PCB, RF PCB, microwave PCB, Rogers PCB, PTFE PCB and antenna PCB projects. The same manufacturing process is used for prototypes and production runs so board performance stays consistent across orders.
What files are needed for quotation?
Please prepare: Gerber files (ZIP format), PCB stackup, material requirement (e.g. Rogers RO4350B), board thickness, copper thickness, surface finish, quantity, impedance requirements and working frequency. Application details also help us review material suitability before quoting. Gerber files can be sent via WhatsApp or email after initial contact.
Need a Reliable High Frequency PCB Supplier?
Send us your Gerber files, stackup, material requirements, copper thickness, surface finish, quantity, and application details. Our team will review your PCB project and provide a quotation.
Contact Us on WhatsApp