PTFE PCB Manufacturer

Custom PTFE PCB manufacturing for RF, microwave, antenna, radar, satellite communication, 5G, and high-frequency electronic applications.

Product Overview

Custom PTFE PCB for Aerospace, Radar and High-Frequency Applications

Riching PCB provides custom PTFE PCB manufacturing for applications requiring the lowest available signal loss. PTFE laminates including Rogers RT5880, Taconic TLY-5 and F4B series offer Df as low as 0.0009 — significantly lower than Rogers RO4350B (Df 0.0037) or standard FR4 (Df ~0.02).

Why PTFE PCB Requires Specialized Manufacturing

PTFE (polytetrafluoroethylene) is chemically inert and has a naturally low surface energy, which makes copper adhesion difficult compared to standard FR4 or hydrocarbon-based Rogers materials. Standard PCB drilling and copper deposition processes are not suitable for PTFE boards. We use plasma treatment before copper sinking on PTFE laminates to activate the hole wall surface and ensure reliable copper bonding in plated through holes. This process is critical for multilayer PTFE PCB reliability and is not performed by all manufacturers.

PTFE PCB fabrication also requires controlled lamination pressure, specialized drill parameters, and careful handling to avoid material deformation. We support 2–36 layer PTFE PCB including PTFE + FR4 hybrid stackups, with engineering review before production to check stackup design, impedance calculation and material compatibility.

PTFE PCB Key Specs

  • Df as low as 0.0009 (RT5880 / TLY-5A)
  • Plasma treatment for PTFE hole wall
  • Min drill diameter: 0.1mm
  • Hole wall plating: 20–50μm
  • Layers: 2–36
  • Board thickness: 0.127mm–10mm
  • Impedance control: ±10%
  • PTFE + FR4 hybrid stackup supported
  • ENIG, immersion silver surface finish
PTFE PCB Materials

PTFE PCB Materials We Support

PTFE materials are commonly selected for RF and microwave PCB projects that require low dielectric loss, stable signal transmission, controlled impedance, and reliable high-frequency performance.

PTFE Laminates

Low-loss PTFE laminates for microwave circuits, RF modules, antenna systems, satellite communication, and high-frequency electronic applications.

PTFE Microwave PCB

Suitable for demanding microwave applications where stable dielectric properties, low signal loss, and precise impedance control are important.

PTFE RF PCB

Used for RF circuits, wireless communication devices, RF modules, antenna feed structures, and signal transmission designs.

Rogers PTFE-Based Materials

Rogers PTFE-based laminates and related high-frequency materials can be reviewed according to frequency, dielectric constant, and project requirements.

F4B Materials

A practical high-frequency material option for RF and microwave PCB projects with balanced performance, availability, and production efficiency.

PTFE Hybrid Stackups

PTFE materials can be combined with FR4 or other high-frequency materials to balance cost, structure, and electrical performance.

Manufacturing Capability

Manufacturing Capabilities for PTFE PCB Projects

PTFE PCB manufacturing requires careful process control for material handling, drilling, lamination, copper plating, impedance, surface finish, and final inspection. We support PTFE PCB projects from prototype verification to repeat batch production.

01

Controlled Impedance

Impedance control for RF transmission lines, microwave circuits, antenna structures, and high-frequency signal paths.

02

PTFE Material Processing

Processing support for PTFE laminates, Rogers PTFE-based materials, F4B materials, and PTFE hybrid stackups.

03

PTFE Stackup Review

Review of dielectric thickness, material selection, copper thickness, impedance notes, and stackup requirements.

04

Multilayer Lamination

Multilayer PTFE PCB and hybrid stackup manufacturing for complex RF, microwave, and antenna PCB structures.

05

Stable Plated Through Holes

Reliable hole wall plating and copper deposition for multilayer PTFE PCB and high-frequency circuit designs.

06

Tight Tolerance Drilling

Precision drilling for vias, plated holes, RF structures, antenna layouts, and compact PTFE PCB designs.

07

Surface Finish Options

ENIG, immersion silver, immersion tin, HASL, OSP, gold plating, and project-based surface finish options.

08

Prototype and Batch Production

Support for PTFE PCB prototype testing, small-batch production, and repeat manufacturing orders.

Technical Capabilities

Technical Capabilities for PTFE PCB Manufacturing

Key manufacturing parameters for PTFE PCB fabrication. Specific requirements confirmed based on your Gerber files, PTFE material selection, stackup and impedance design.

Item Capability
PCB Type PTFE PCB, Teflon PCB, microwave PCB, radar PCB, aerospace PCB, satellite communication PCB
PTFE Materials Rogers RT5880 (Dk 2.2), RT5870 (Dk 2.33), Taconic TLY-5A (Dk 2.17), TLY-5 (Dk 2.22), TLP-5 (Dk 2.2), RF-35 (Dk 3.5), RF-60A (Dk 6.5), CER-10 (Dk 10.0), F4B series
Dielectric Loss (Df) As low as Df 0.0009 (RT5880 / TLY-5A / TLP-5); RF-35: 0.0018; RF-60A: 0.0038; CER-10: 0.0035
PTFE Processing Plasma treatment applied before copper sinking on PTFE hole walls to ensure reliable copper bonding in plated through holes
Hybrid Stackup PTFE + FR4 hybrid stackup supported; PTFE signal layers with FR4 core for cost-optimized multilayer designs
Layers 2–36 layers; single-sided, double-sided and multilayer PTFE PCB supported
Board Thickness 0.127mm–10mm; standard PTFE laminate thicknesses from 0.09mm (Taconic TLY) available
Copper Thickness 0.5oz–5oz finished copper; inner and outer layer copper per design requirements
Min Trace / Space 2.5mil / 3mil (advanced); 3mil / 4mil (standard)
Min Drill Diameter 0.1mm mechanical drill; hole tolerance ±0.05mm; aspect ratio up to 14:1
Layer Registration ±0.05mm layer-to-layer registration accuracy
Hole Wall Plating 20–50μm copper in plated through holes; verified by cross-section inspection before shipment
Impedance Control ±10% standard; ±5Ω for values below 50Ω; verified by impedance testing before delivery
Surface Finish ENIG (gold 1–5μ″, nickel ≥120μ″), immersion silver, immersion tin, HASL, OSP, electroplated gold
Max Board Size 480 × 800mm finished board
Production Type Prototype, small batch and volume production
Quality Inspection PTFE material verification, plasma process check, AOI, electrical testing, impedance testing, cross-section inspection, final inspection
Applications

Typical Applications of PTFE PCB

PTFE PCBs are widely used in RF and microwave applications where low signal loss, stable dielectric performance, controlled impedance, and high-frequency reliability are important.

Microwave Circuits
RF Modules
Antenna Systems
Radar Systems
Satellite Communication
5G Infrastructure
Aerospace Electronics
Test & Measurement Equipment
Industrial RF Devices
Wireless Transmission Systems
Quality Control

Quality Control for PTFE PCB Manufacturing

PTFE PCB production requires careful process control. Material stability, impedance accuracy, plated through-hole reliability, copper bonding, lamination quality, surface finish, and final inspection all affect the performance of RF and microwave circuits.

Before production, we review Gerber files, PTFE material requirements, stackup structure, copper thickness, surface finish, impedance notes, and special process requirements. During and after production, inspection steps can include AOI inspection, electrical testing, impedance testing, cross-section inspection, plated through-hole inspection, and final quality control before shipment.

PTFE Material Verification
Stackup Review Before Production
Controlled Impedance Check
AOI Inspection
Electrical Testing
Cross-Section Inspection
Plated Through-Hole Inspection
Final Inspection Before Shipment
RFQ Information

What to Send for a PTFE PCB Quotation

To provide an accurate quotation, please send your Gerber files and PTFE PCB project details. Complete information helps us review the material choice, stackup, impedance, surface finish, and production requirements more efficiently.

Gerber Files
PTFE Material Requirement
PCB Stackup
Board Thickness
Copper Thickness
Surface Finish
Quantity
Impedance Requirement
Working Frequency If Available
Application Details
Special Tolerance Requirements
Special Process Requirements
FAQ

PTFE PCB FAQ

Common questions about PTFE PCB materials, manufacturing process, material selection and quotation requirements.

What is a PTFE PCB?

A PTFE PCB (also called Teflon PCB) is a printed circuit board manufactured using polytetrafluoroethylene-based laminates. PTFE materials offer the lowest dielectric loss among common PCB substrates, with dissipation factor (Df) as low as 0.0009. This makes PTFE PCBs the preferred choice for aerospace electronics, radar systems, satellite communication, and mmWave applications where signal loss must be minimized. PTFE PCBs require specialized manufacturing processes compared to standard FR4 or hydrocarbon-based Rogers materials.

What is the difference between PTFE PCB and Rogers PCB?

Rogers is a brand that makes both PTFE-based and non-PTFE laminates. Rogers RT/duroid series (RT5880, RT5870) are PTFE-based materials. Rogers RO4000 series (RO4350B, RO4003C) are hydrocarbon-based and process more like standard FR4. PTFE PCB generally refers to boards using PTFE-based laminates from any manufacturer — including Rogers RT/duroid, Taconic TLY series, or F4B. The key advantage of PTFE over hydrocarbon Rogers is lower Df (0.0009 vs 0.0037), which means less signal loss at high frequencies. The trade-off is higher cost and more complex manufacturing.

Why is PTFE PCB harder to manufacture than standard PCB?

PTFE is chemically inert with very low surface energy, which makes copper adhesion to hole walls extremely difficult using standard electroless copper processes. Without proper surface treatment, copper plating will not bond reliably to PTFE hole walls, leading to plating voids and reliability failures. We use plasma treatment before copper sinking on PTFE boards to activate the hole wall surface and ensure reliable copper bonding. This step is critical for multilayer PTFE PCB and is not performed by all manufacturers. PTFE also requires controlled lamination pressure and specialized drill parameters to avoid material deformation.

What PTFE materials do you support?

We support Rogers RT5880 (Dk 2.2, Df 0.0009), RT5870 (Dk 2.33, Df 0.0012), Taconic TLY-5A (Dk 2.17, Df 0.0009), TLY-5 (Dk 2.22), TLP-5 (Dk 2.2), RF-35 (Dk 3.5, Df 0.0018), RF-60A (Dk 6.5, Df 0.0038), CER-10 (Dk 10.0, Df 0.0035), and F4B series laminates. Material selection depends on working frequency, Dk requirement, loss budget and application environment.

When should I choose PTFE PCB over Rogers RO4350B?

Choose PTFE PCB when your application requires the lowest possible signal loss, typically for frequencies above 20GHz or in loss-critical designs such as radar receivers, satellite uplinks, aerospace RF modules, and mmWave circuits. RT5880 (Df 0.0009) has about 4x lower loss than RO4350B (Df 0.0037). For most 5G and general RF applications below 20GHz, RO4350B provides sufficient performance at lower cost and with simpler manufacturing. If your loss budget allows RO4350B, it is usually the more practical choice.

Do you support PTFE + FR4 hybrid stackup PCB?

Yes. We support PTFE + FR4 hybrid stackups where RF-critical signal layers use PTFE laminates and structural or power layers use standard FR4. This approach significantly reduces material cost while maintaining low-loss performance on critical RF layers. Hybrid PTFE stackups require careful review of material compatibility, lamination sequence, and dielectric thickness. Engineering review is included before production for all hybrid stackup designs.

What files do I need for a PTFE PCB quotation?

Please prepare: Gerber files (ZIP format), PTFE material requirement (e.g. Rogers RT5880 0.254mm), PCB stackup, board thickness, copper thickness, surface finish, quantity, impedance requirements, and working frequency. For hybrid stackups, please specify the material for each layer. Application details help us review material suitability and plasma process requirements before production.

Need a Reliable High Frequency PCB Supplier?

Send us your Gerber files, stackup, material requirements, copper thickness, surface finish, quantity, and application details. Our team will review your PCB project and provide a quotation.

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