RF PCB Manufacturer
Custom RF PCB manufacturing for wireless communication, antenna modules, RF circuits, signal transmission, radar, 5G, and high-frequency electronic applications.
Custom RF PCB for Wireless and High-Frequency Applications
Riching PCB provides custom RF PCB manufacturing focused on impedance control, low transmission loss, and stable signal integrity. We support Rogers, PTFE, Taconic and F4B materials for wireless communication, antenna, radar, 5G and high-frequency RF circuit applications.
RF PCB Manufacturing Focused on Signal Integrity
RF PCB performance depends on three critical factors: impedance matching, transmission line loss, and dielectric stability. A mismatch in any of these causes signal reflection, power loss, and inconsistent RF behavior. Our RF PCB manufacturing controls trace width to ±0.01mm, supports 50Ω and 75Ω impedance with tolerance ±10%, and uses low-loss substrates with Df as low as 0.0009 to minimize insertion loss across the signal path.
We support 2–36 layer RF PCB fabrication with minimum trace width 2.5mil, drill diameter from 0.1mm, copper plating 20–50μm in plated holes, and surface finishes including ENIG and immersion silver for reliable RF connector and component interfaces. Engineering review is included before production to check stackup, impedance design, and material suitability.
RF PCB Key Specs
- 50Ω / 75Ω impedance control ±10%
- Min trace / space: 2.5mil / 3mil
- Min drill diameter: 0.1mm
- Layers: 2–36
- Board thickness: 0.1–10mm
- Copper thickness: 0.5oz–5oz
- Df as low as 0.0009 (RT5880)
- ENIG, immersion silver, OSP surface finish
- Prototype and batch production
RF PCB Materials We Support
RF PCB material selection affects signal loss, dielectric stability, impedance, thermal performance, and long-term reliability. We can review material options according to working frequency, stackup, cost, and application environment.
Rogers Materials
Rogers RO4000 series, RT/duroid series, and other Rogers laminates for RF, antenna, radar, microwave, and communication PCB projects.
PTFE Laminates
Low-loss PTFE materials for RF modules, microwave circuits, antenna systems, and high-frequency signal transmission applications.
Taconic Materials
Commonly used for RF and microwave PCB projects requiring stable dielectric performance and low signal loss.
F4B Materials
A practical option for RF PCB projects with balanced material performance, availability, and production efficiency.
FR4 + High Frequency Hybrid Stackups
Hybrid structures combine FR4 and high-frequency materials to balance cost, mechanical support, and electrical performance.
Other RF PCB Materials
We can review additional high-frequency materials based on customer drawings, stackup, working frequency, and project requirements.
Manufacturing Capabilities for RF PCB Projects
RF PCB manufacturing requires careful control of materials, impedance, drilling, lamination, copper plating, surface finish, and final inspection. We support RF PCB projects from prototype to batch production.
Controlled Impedance
Impedance control for RF transmission lines, antenna feed lines, and high-speed signal paths.
Low-Loss Material Processing
Processing support for Rogers, PTFE, Taconic, F4B, FR4 hybrid, and other RF PCB materials.
RF Stackup Review
Review of stackup structure, material selection, copper thickness, and impedance requirements.
Multilayer Lamination
Multilayer RF PCB and hybrid stackup manufacturing for complex communication and signal designs.
Stable Plated Through Holes
Reliable hole wall plating and copper deposition for RF modules and multilayer PCB structures.
Tight Tolerance Drilling
Precision drilling for vias, plated holes, RF structures, and compact PCB layouts.
Surface Finish Options
ENIG, immersion silver, immersion tin, HASL, OSP, gold plating, and other project-based options.
Prototype and Batch Production
Support for RF PCB prototype verification, small-batch production, and repeat manufacturing orders.
Custom RF PCB for Wireless and High-Frequency Applications
Riching PCB provides custom RF PCB manufacturing focused on impedance control, low transmission loss, and stable signal integrity. We support Rogers, PTFE, Taconic and F4B materials for wireless communication, antenna, radar, 5G and high-frequency RF circuit applications.
RF PCB Manufacturing Focused on Signal Integrity
RF PCB performance depends on three critical factors: impedance matching, transmission line loss, and dielectric stability. A mismatch in any of these causes signal reflection, power loss, and inconsistent RF behavior. Our RF PCB manufacturing controls trace width to ±0.01mm, supports 50Ω and 75Ω impedance with tolerance ±10%, and uses low-loss substrates with Df as low as 0.0009 to minimize insertion loss across the signal path.
We support 2–36 layer RF PCB fabrication with minimum trace width 2.5mil, drill diameter from 0.1mm, copper plating 20–50μm in plated holes, and surface finishes including ENIG and immersion silver for reliable RF connector and component interfaces. Engineering review is included before production to check stackup, impedance design, and material suitability.
RF PCB Key Specs
- 50Ω / 75Ω impedance control ±10%
- Min trace / space: 2.5mil / 3mil
- Min drill diameter: 0.1mm
- Layers: 2–36
- Board thickness: 0.1–10mm
- Copper thickness: 0.5oz–5oz
- Df as low as 0.0009 (RT5880)
- ENIG, immersion silver, OSP surface finish
- Prototype and batch production
Quality Control for RF PCB Manufacturing
RF PCB production requires more than standard PCB fabrication. Material stability, impedance accuracy, plated through-hole reliability, copper bonding, surface finish quality, and final inspection all affect the performance of RF circuits and signal transmission.
Before production, we review Gerber files, stackup structure, RF material requirements, copper thickness, surface finish, impedance notes, and special process requirements. During and after production, inspection steps can include AOI inspection, electrical testing, impedance testing, cross-section inspection, plated through-hole inspection, and final quality control before shipment.
What to Send for an RF PCB Quotation
To provide an accurate quotation, please send your Gerber files and RF PCB project details. The more complete the information, the faster we can review your material, stackup, impedance and production requirements.
Ready to Quote?
Send your RF PCB files and project requirements directly on WhatsApp.
Send Gerber Files on WhatsAppRF PCB FAQ
Common questions about RF PCB materials, impedance control, manufacturing capability and quotation requirements.
What is an RF PCB?
An RF PCB (radio frequency printed circuit board) is designed for signal transmission at radio frequencies, typically from a few MHz up to several GHz. Unlike standard digital PCBs, RF PCBs require controlled impedance, low-loss substrate materials, precise copper geometry, and stable dielectric properties to maintain signal integrity and minimize transmission loss across the RF signal path.
What is the difference between an RF PCB and a standard PCB?
Standard PCBs use FR4 material which has a relatively high dissipation factor (Df ~0.02) and unstable dielectric constant at high frequencies. RF PCBs use low-loss materials such as Rogers RO4350B (Df 0.0037), RT5880 (Df 0.0009), or PTFE laminates to reduce insertion loss and maintain consistent impedance. RF PCBs also require tighter trace width control (±0.01mm) and impedance verification by testing before shipment.
What does 50 ohm impedance mean for RF PCB?
50Ω is the standard characteristic impedance for most RF transmission lines, chosen as a practical balance between power handling and signal loss. On an RF PCB, achieving 50Ω requires precise control of trace width, dielectric thickness, and copper thickness. We support 50Ω and 75Ω controlled impedance with tolerance ±10% standard and ±5Ω for values below 50Ω, verified by impedance testing before delivery.
What materials do you support for RF PCB manufacturing?
We support Rogers (RO4350B, RO4003C, RO3003, RT5880, RT5870), PTFE laminates, Taconic (TLY-5, RF-35, CER-10), F4B series, and FR4 hybrid stackups. Rogers RO4350B (Dk 3.48, Df 0.0037) is the most widely used material for RF amplifiers, 5G antennas and communication modules. RT5880 (Dk 2.2, Df 0.0009) suits ultra-low-loss radar and aerospace RF designs.
What are your minimum trace width and drill capabilities for RF PCB?
Minimum trace width and spacing is 2.5mil/3mil for advanced capability and 3mil/4mil for standard production. Trace width tolerance is ±0.01mm. Minimum mechanical drill diameter is 0.1mm with hole tolerance ±0.05mm and aspect ratio up to 14:1. These parameters may vary depending on copper thickness, material and stackup design.
Do you support multilayer RF PCB with hybrid stackups?
Yes. We support 2–36 layer RF PCB manufacturing including hybrid stackups that combine Rogers or PTFE layers with FR4 core layers. Hybrid stackups allow RF-critical signal layers to use low-loss materials while structural layers use standard FR4, reducing cost without compromising RF performance on the critical layers.
What files do I need to send for an RF PCB quote?
Please prepare: Gerber files (ZIP format), PCB stackup, material requirement (e.g. Rogers RO4350B), board thickness, copper thickness, surface finish, quantity, impedance target (e.g. 50Ω), reference layer, and working frequency. Application details help us review material suitability. Gerber files can be sent via WhatsApp or email after initial contact.
Need a Reliable High Frequency PCB Supplier?
Send us your Gerber files, stackup, material requirements, copper thickness, surface finish, quantity, and application details. Our team will review your PCB project and provide a quotation.
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