Microwave PCB Manufacturer
Custom microwave PCB manufacturing for radar systems, satellite communication, RF modules, antenna systems, microwave circuits, and high-frequency electronic applications.
Custom Microwave PCB for Radar, Satellite and High-Frequency Applications
Riching PCB provides custom microwave PCB manufacturing focused on dielectric stability, ultra-low signal loss, and precise circuit geometry. We support Rogers RT/duroid, PTFE, Taconic and other low-loss laminates for radar, satellite communication, aerospace and advanced microwave circuit applications.
Microwave PCB Manufacturing Focused on Dielectric Stability
At microwave frequencies (typically 1GHz and above), even small variations in dielectric constant (Dk), copper surface roughness, or layer registration can cause measurable signal degradation. Microwave PCB manufacturing requires stricter process control than standard RF fabrication — particularly in material handling, lamination pressure, drilling accuracy, and copper bonding.
We process Rogers RT5880 (Dk 2.2, Df 0.0009), RO3003 (Dk 3.0, Df 0.0010), Taconic CER-10 (Dk 10.0) and PTFE laminates with layer registration ±0.05mm, hole wall copper plating 20–50μm, and min drill diameter 0.1mm. Impedance is verified by cross-section inspection and impedance testing before every shipment. Engineering review is included before production to check stackup, material suitability and impedance design.
Microwave PCB Key Specs
- Df as low as 0.0009 (RT5880 / TLY-5)
- Layer registration: ±0.05mm
- Min drill diameter: 0.1mm
- Hole wall plating: 20–50μm
- Layers: 2–36
- Board thickness: 0.1–10mm
- Impedance control: ±10%
- ENIG, immersion silver surface finish
- Prototype and batch production
Microwave PCB Materials We Support
Microwave PCB material selection is critical for signal performance, dielectric stability, insertion loss, impedance control, and long-term reliability. We can review material options according to working frequency, stackup, cost, thermal performance, and application environment.
Rogers Materials
Rogers RO4000 series, RT/duroid series, and other Rogers laminates for microwave circuits, radar systems, antenna modules, and communication PCB projects.
PTFE Laminates
Low-loss PTFE materials for demanding microwave circuits, RF modules, antenna systems, and high-frequency signal transmission applications.
Taconic Materials
Used in microwave and RF PCB projects requiring low dielectric loss, stable signal performance, and reliable high-frequency operation.
F4B Materials
A practical microwave PCB material option with balanced performance, availability, and production efficiency for RF and microwave designs.
FR4 + High Frequency Hybrid Stackups
Hybrid structures combine FR4 and high-frequency materials to balance cost, mechanical strength, and microwave signal performance.
Other Microwave PCB Materials
We can review other high-frequency and microwave materials based on customer specifications, working frequency, stackup, and application requirements.
Manufacturing Capabilities for Microwave PCB Projects
Microwave PCB manufacturing requires strict process control for materials, lamination, drilling, copper plating, impedance, surface finish, and final inspection. We support microwave PCB projects from prototype verification to batch production.
Controlled Impedance
Impedance control for microwave transmission lines, RF circuits, antenna structures, and high-frequency signal paths.
Low-Loss Material Processing
Processing support for Rogers, PTFE, Taconic, F4B, FR4 hybrid, and other microwave PCB materials.
Microwave Stackup Review
Review of stackup structure, dielectric thickness, copper thickness, impedance notes, and material requirements.
Multilayer Lamination
Multilayer microwave PCB manufacturing for complex stackups, mixed-material structures, and advanced RF systems.
Stable Plated Through Holes
Reliable hole wall plating and copper deposition for multilayer microwave circuit boards and RF modules.
Tight Tolerance Drilling
Precision drilling for vias, plated through holes, microwave structures, and compact high-frequency PCB layouts.
Surface Finish Options
ENIG, immersion silver, immersion tin, HASL, OSP, gold plating, and other project-based surface finish options.
Prototype and Batch Production
Support for microwave PCB prototype testing, small-batch production, and repeat manufacturing orders.
Technical Capabilities for Microwave PCB Manufacturing
Key manufacturing parameters for microwave PCB fabrication. Specific requirements confirmed based on your Gerber files, microwave stackup, material and impedance design.
| Item | Capability |
|---|---|
| PCB Type | Microwave PCB, radar PCB, satellite communication PCB, microwave module PCB, antenna PCB |
| Materials | Rogers RT5880 (Dk 2.2), RO3003 (Dk 3.0), RO6010 (Dk 10.2), Taconic CER-10 (Dk 10.0), RF-35 (Dk 3.5), PTFE laminates, F4B, FR4 hybrid |
| Dielectric Loss (Df) | As low as Df 0.0009 (RT5880 / TLY-5A); RO3003 Df 0.0010; RF-35 Df 0.0018; CER-10 Df 0.0035 |
| Layers | 2–36 layers; multilayer microwave PCB and hybrid stackups supported |
| Board Thickness | 0.1–10.0mm; Rogers and PTFE standard thicknesses from 0.127mm available |
| Copper Thickness | 0.5oz–5oz finished copper; inner and outer layer copper per design |
| Min Trace / Space | 2.5mil / 3mil (advanced); 3mil / 4mil (standard) |
| Min Drill Diameter | 0.1mm mechanical drill; hole tolerance ±0.05mm; aspect ratio up to 14:1 |
| Layer Registration | ±0.05mm layer-to-layer registration accuracy |
| Hole Wall Plating | 20–50μm copper in plated through holes; verified by cross-section inspection |
| Impedance Control | ±10% standard; ±5Ω for values below 50Ω; verified by impedance testing before shipment |
| Surface Finish | ENIG (gold 1–5μ″, nickel ≥120μ″), immersion silver, immersion tin, HASL, OSP, electroplated gold |
| Max Board Size | 480 × 800mm finished board |
| Production Type | Prototype, small batch and volume production |
| Quality Inspection | AOI, electrical testing, impedance testing, cross-section inspection, layer registration check, final inspection |
Typical Applications of Microwave PCB
Microwave PCBs are widely used in systems where low signal loss, stable dielectric performance, impedance control, and high-frequency reliability are critical.
Quality Control for Microwave PCB Manufacturing
Microwave PCB production requires more than standard PCB fabrication. Material stability, impedance accuracy, plated through-hole reliability, copper bonding, surface finish quality, and final inspection all affect microwave circuit performance.
Before production, we review Gerber files, stackup structure, microwave material requirements, copper thickness, surface finish, impedance notes, and special process requirements. During and after production, inspection steps can include AOI inspection, electrical testing, impedance testing, cross-section inspection, plated through-hole inspection, and final quality control before shipment.
What to Send for a Microwave PCB Quotation
To provide an accurate quotation, please send your Gerber files and microwave PCB project details. The more complete the information, the faster we can review your material, stackup, impedance, and production requirements.
Ready to Quote?
Send your microwave PCB files and project requirements directly on WhatsApp.
Send Gerber Files on WhatsAppMicrowave PCB FAQ
Common questions about microwave PCB materials, manufacturing process, frequency range, and quotation requirements.
What is a microwave PCB?
A microwave PCB is a printed circuit board designed for signal transmission at microwave frequencies, typically from 1GHz up to 100GHz and beyond. At these frequencies, standard FR4 material causes significant signal loss due to its high dissipation factor (Df ~0.02). Microwave PCBs use specialized low-loss materials such as Rogers RT5880 (Df 0.0009), RO3003 (Df 0.0010), or PTFE laminates to maintain signal integrity and minimize insertion loss across the circuit.
What is the difference between a microwave PCB and an RF PCB?
RF PCB is a broader term covering radio frequency circuits from a few MHz up to several GHz. Microwave PCB specifically refers to circuits operating at 1GHz and above, where dielectric stability, copper surface roughness, and layer registration accuracy have a more significant impact on performance. Microwave PCBs typically require stricter material control, tighter layer registration (±0.05mm), and more precise drilling compared to lower-frequency RF designs. Materials like Rogers RT5880 and PTFE laminates are more commonly specified for microwave applications than for general RF circuits.
What materials do you support for microwave PCB?
We support Rogers RT5880 (Dk 2.2, Df 0.0009), RT5870 (Dk 2.33), RO3003 (Dk 3.0, Df 0.0010), RO6010 (Dk 10.2), Taconic TLY-5 (Dk 2.22, Df 0.0009), CER-10 (Dk 10.0, Df 0.0035), RF-35 (Dk 3.5, Df 0.0018), F4B series, and PTFE laminates. Material selection depends on working frequency, Dk requirement, loss budget, thermal performance, and cost. We can review material options based on your application before production.
Why is dielectric constant (Dk) stability important for microwave PCB?
At microwave frequencies, the electrical wavelength inside the PCB is very short. Even a small variation in Dk across the board causes phase errors and impedance inconsistency that degrade circuit performance. Materials like Rogers RT5880 maintain Dk stability across temperature and frequency, while standard FR4 shows significant Dk variation above 1GHz. For microwave circuits, we recommend materials with Dk tolerance tighter than ±0.05 for consistent performance.
What is your layer registration accuracy for microwave PCB?
Our layer-to-layer registration accuracy is ±0.05mm for multilayer microwave PCB. This is critical for microwave designs where signal layers, ground planes, and via structures must be precisely aligned to maintain impedance and minimize signal coupling between layers.
Do you support multilayer microwave PCB with PTFE materials?
Yes. We support multilayer microwave PCB manufacturing using PTFE-based materials including Rogers RT/duroid series and Taconic TLY series. PTFE multilayer processing requires specialized handling for drilling, copper bonding, and lamination. We use plasma treatment for copper sinking on PTFE boards to ensure reliable hole wall adhesion in multilayer structures.
What files do I need for a microwave PCB quotation?
Please prepare: Gerber files (ZIP format), PCB stackup, material requirement (e.g. Rogers RT5880), board thickness, copper thickness, surface finish, quantity, impedance requirements, working frequency, and application details. For microwave designs, please also include any dielectric thickness requirements between signal and ground layers, as these directly affect impedance calculation and material selection.