Rogers PCB Manufacturer

A Rogers PCB is a printed circuit board manufactured using Rogers Corporation laminates instead of standard FR4. Rogers materials offer stable dielectric constant (Dk), low dissipation factor (Df), and consistent electrical performance at high frequencies. They are widely used in RF amplifiers, 5G antennas, radar systems, satellite communication, and microwave circuits where standard FR4 cannot maintain signal integrity at operating frequency.

RO4350B (Dk 3.48, Df 0.0037) and RO4003C (Dk 3.38, Df 0.0027) are both from the Rogers RO4000 series and process similarly to standard FR4. RO4003C has a slightly lower Df and Dk, making it suitable for applications requiring lower insertion loss and more precise impedance control. RO4350B is more widely available and commonly used for 5G antennas, RF amplifiers and communication modules where cost and availability matter. For most RF applications below 10GHz, either material works well. Above 10GHz or in loss-critical designs, RO4003C is often preferred.

RT5880 (Dk 2.2, Df 0.0009) has significantly lower dielectric loss than RO4350B (Df 0.0037), making it the preferred choice for radar systems, aerospace electronics, satellite communication and mmWave applications above 20GHz where every 0.1dB of insertion loss matters. RT5880 is a PTFE-based material and requires more specialized processing than RO4350B. It is also more expensive. For most 5G and general RF applications below 20GHz, RO4350B provides sufficient performance at lower cost and with easier manufacturability.

We stock and process RO4350B, RO4003C, RO3003, RO3006, RO3010, RT5880, RT5870 and RO6010. These cover Dk values from 2.2 to 10.2 for a wide range of RF, microwave, radar and satellite applications. Standard thicknesses are available from 0.101mm (RO4350B) and 0.127mm (RT5880) up to 1.524mm and beyond. Other Rogers materials can be reviewed based on project requirements.

Yes. We support Rogers + FR4 hybrid stackups where RF-critical signal layers use Rogers laminates and structural or power layers use standard FR4. This approach reduces material cost while maintaining RF performance on critical layers. Hybrid stackups require careful review of dielectric thickness, copper distribution, and lamination sequence. We include engineering review before production for all hybrid stackup designs.

The main factors are working frequency, loss requirement, Dk value, thermal performance, and cost. For most RF and 5G applications below 20GHz, RO4350B is the standard choice. For lower loss requirements, use RO4003C or RO3003. For mmWave and aerospace designs above 20GHz, RT5880 is typically specified. For high-Dk compact designs, RO3006, RO3010 or RO6010 may be appropriate. Send us your frequency, application and loss budget and we can recommend the right material before you commit to a design.

Please prepare: Gerber files (ZIP format), Rogers material requirement (e.g. RO4350B 0.508mm), PCB stackup, board thickness, copper thickness, surface finish, quantity, impedance requirements, and working frequency. For hybrid stackups, please include the full layer stackup with material specified for each layer. Gerber files can be sent via WhatsApp or email after initial contact.