Wireless Base Station PCB Manufacturer
Riching PCB manufactures RF front-end, power amplifier, and antenna array PCB for wireless base station and telecom infrastructure equipment. Rogers RO4350B, RO4003C and RO3003 in stock — no material procurement delay. Hybrid FR4 stackups for cost-effective digital sections. IATF16949 certified. See 5G communication module PCB design guide for material selection background by frequency band.
Table of Contents
RO4350B
RO3003
in stock
no material wait
5–10
day prototype
RF + hybrid stackup
±5%
TDR impedance
verification
IATF16949
certified
No MOQ
Board Types by Base Station Function
| Board Type | Typical Material | Riching PCB Capability |
|---|---|---|
| RF front-end (filter, PA matching) | Rogers RO4350B / RO4003C | In stock, 5–7 day prototype, hybrid FR4 stackup supported |
| Power amplifier board | Rogers RO4350B, 2oz+ copper | Thermal via array, copper-fill vias, TDR impedance verification |
| Antenna array / AAU panel | Rogers RO3003 | In stock 0.127/0.254mm, in-house plasma activation, panel-level TDR |
| Digital baseband / BBU | FR4, Hi-Tg FR4 | High layer count, fine pitch BGA support |
| Backhaul / transceiver module | RO4350B or RO4003C | Controlled impedance ±5%, ENIG standard |
Manufacturing Capability
| Capability | Specification |
|---|---|
| Materials in stock | Rogers RO4350B, RO4003C, RO3003, RT5880; Taconic; F4B; FR4/Hi-Tg FR4 |
| Layer count | 1–50 layers, hybrid RF/FR4 stackups supported |
| Impedance control | ±10% standard, ±5% TDR-verified available |
| Copper weight | 0.5oz–3oz+, thermal via array support |
| PTFE processing | In-house plasma activation, max 2 lamination cycles |
| Surface finish | ENIG standard, ENEPIG and immersion silver available |
| Certification | IATF16949, ISO9001 |
| Prototype lead time | 5–7 days (RO4350B/FR4), 7–10 days (RO3003/RT5880) |
| MOQ | None — from 1 board |
| Assembly | In-house SMT, no lead-free MOQ, BGA/QFN 0.4mm pitch, AOI + X-Ray |
RF Front-End and Power Amplifier Boards
Base station RF front-end and power amplifier boards require both RF performance (filter insertion loss, PA matching network impedance control) and thermal management for high-power PA devices. See RF power amplifier PCB design guide for thermal via array design, copper weight considerations and grounding rules specific to base station PA sections.
Antenna Array and AAU Panels
Active antenna unit (AAU) and massive MIMO panels use phased array design principles — Rogers RO3003 substrate, λ/2 element spacing, and panel-level Dk uniformity verification. See phased array PCB manufacturer for element spacing reference and feed network design capability.
Hybrid Stackup for Cost Optimization
Most base station boards combine RF signal layers (Rogers) with digital baseband and power delivery layers (FR4) in a single hybrid stackup. This reduces material cost significantly compared to an all-Rogers board while maintaining RF performance where it matters. See Rogers PCB manufacturer for hybrid stackup bonding film requirements and material stock.
Documentation and Certification
- IATF16949 certified — automotive-grade quality management system
- Material lot certificates and traceability records available
- TDR impedance verification reports with delivery
- IPC Class 2 standard, Class 3 on request
How to Order
- WhatsApp: +86 13760473650
- Send: Gerber zip + NC drill + stackup drawing
- Specify: board function (RF front-end, PA, antenna array, baseband), material, impedance requirements
- DFM review: 4–8 hours
- No MOQ. From 1 board to production volume.
Wireless Base Station PCB — Shenzhen Direct Factory
Rogers RO4350B & RO3003 In Stock
RF Front-End · PA · Antenna Array · No MOQ
Send Gerber + stackup drawing. DFM review within 4–8 hours.
IATF16949 certified, material traceability documentation available.
DFM review within 4–8 hours
Request a PCB Quote
Upload your Gerber ZIP file and project requirements. Our engineering team will review your PCB material, stackup, impedance needs, surface finish, and production quantity before quoting.
Please prepare:
- Gerber files in ZIP format
- PCB material or stackup requirements
- Controlled impedance notes if available
- Prototype or batch production quantity