Aerospace & Defense PCB Material Qualification — IPC Class 3, Traceability and Test Requirements Aerospace and defense PCB programs require a different level of documentation and process control than commercial RF PCB. The electrical design (material selection, stackup, impedance) is…
5G Communication Module PCB Design Guide — Sub-6GHz Material Selection and RF Front-End Layout 5G communication module PCB spans a wider frequency range than any previous cellular generation — from 600MHz low-band through 6GHz mid-band (FR1) to 24–40GHz mmWave (FR2).…
ENIG vs ENEPIG vs Immersion Silver for RF PCB — Which Surface Finish and Why Surface finish selection for RF PCB is not purely a solderability or cost decision — at high frequency, the finish sits directly in the current…
RF Power Amplifier PCB Design Guide — Thermal Management, Substrate Selection and Grounding RF power amplifier PCB design combines two sets of constraints that do not usually appear together: RF signal integrity requirements (controlled impedance, low insertion loss, isolation between…
Phased Array PCB Design Guide — Element Spacing, Feed Network and Dk Uniformity Phased array PCB design introduces constraints that do not appear in single-channel RF design: element-to-element phase consistency across the full aperture, feed network amplitude and phase balance…
Ka-Band PCB Design Guide — Material Selection, Element Spacing and Loss Budget Ka-band (26.5–40GHz) spans the operating frequencies for LEO and GEO satellite communications, 5G mmWave, point-to-point microwave links, and Ka-band radar. This guide covers the practical PCB design parameters…
