Low-Noise Amplifier PCB Design — Grounding, Shielding and Layout Rules for Minimum Noise Figure A low-noise amplifier’s datasheet noise figure is achieved only under the specific source and ground conditions the manufacturer tested against — the PCB around the device…
mmWave Air-Cavity Package to PCB Transition — GCPW Launch and Bond Wire Parasitics As RF packages push toward 40GHz and above, the transition between the package and the PCB becomes a significant design element in its own right — not…
X-Band and Ku-Band AESA Radar PCB Manufacturing — T/R Module Boards and Material Selection Active Electronically Scanned Array (AESA) radar at X-band (8–12GHz) and Ku-band (12–18GHz) combines several distinct PCB types in a single system — T/R module carriers, radiating…
RF PCB Simulation-Ready Material Data — What to Request Before EM Modeling EM simulation tools increasingly model substrate and pad-level effects explicitly rather than treating the board as an idealized structure — recent updates to major component and material model…
QFN MMIC RF PCB Layout — Ground Via Pattern, Isolation and Manufacturing Tolerance Integrating filters, switches, and frequency synthesizers into QFN packages reduces board area, but it concentrates more of the RF performance risk into the PCB layout immediately surrounding…
PCB-to-Waveguide Transition Design — Microstrip Launch, Loss Budget and Manufacturing Tolerance As mmWave antenna and interconnect designs push toward W-band and beyond, more systems are combining a standard PCB with a waveguide or 3D-printed metallized waveguide structure rather than relying…
