RF Power Amplifier PCB Design Guide — Thermal Management, Substrate Selection and Grounding RF power amplifier PCB design combines two sets of constraints that do not usually appear together: RF signal integrity requirements (controlled impedance, low insertion loss, isolation between…
Phased Array PCB Design Guide — Element Spacing, Feed Network and Dk Uniformity Phased array PCB design introduces constraints that do not appear in single-channel RF design: element-to-element phase consistency across the full aperture, feed network amplitude and phase balance…
Ka-Band PCB Design Guide — Material Selection, Element Spacing and Loss Budget Ka-band (26.5–40GHz) spans the operating frequencies for LEO and GEO satellite communications, 5G mmWave, point-to-point microwave links, and Ka-band radar. This guide covers the practical PCB design parameters…
EW PCB Wideband Design Guide — Material Selection, Stub Length and Loss Budget Across 2–18GHz Electronic warfare PCB design presents a constraint that most RF designs don’t face: the same board must perform consistently across a very wide instantaneous bandwidth…
77GHz Radar PCB Design Guide — Patch Array, Via Fence and Stackup Rules 77GHz FMCW radar PCB design operates at the edge of what conventional PCB fabrication tolerances can reliably support — element spacing under 2mm, trace widths under 0.3mm,…
LEO Satellite PCB Design Guide — Ka-Band Materials and Thermal Cycling Low Earth orbit (LEO) satellite terminals and small satellite payloads present a PCB design environment unlike any terrestrial RF application: extreme thermal cycling, vacuum-compatible material requirements, mechanical robustness for…
