Table of Contents
Key point: Rogers RO4350B is a hydrocarbon ceramic laminate with Dk 3.48 and Df 0.0037. It processes on standard FR4-compatible equipment — no plasma activation required. Available thicknesses: 0.101, 0.168, 0.254, 0.338, 0.422, 0.508, 0.762, 1.524 mm. Standard for RF and microwave applications from 1 GHz to 12 GHz, including 5G sub-6GHz, WiFi 6, antenna systems, and radar front-ends. Riching PCB stocks RO4350B in all standard thicknesses. No MOQ. Prototype lead time 5–7 working days.
Rogers RO4350B is the most widely used high frequency PCB material in commercial RF and microwave design. It is a hydrocarbon ceramic laminate — not a PTFE material — which means it can be fabricated using standard FR4-compatible processes without plasma hole wall activation, special drill parameters, or PTFE bondply. This makes RO4350B the default choice for engineers who need reliable high frequency performance without the manufacturing complexity of pure PTFE substrates.
What Is Rogers RO4350B?
RO4350B belongs to the Rogers RO4000 series — a family of thermoset hydrocarbon ceramic laminates designed for RF and microwave PCB applications. The B suffix indicates the current production version with halogen-free flame retardant chemistry meeting UL 94 V-0.
Unlike PTFE-based Rogers materials (RO3003, RT5880), RO4350B does not require plasma hole wall activation before copper plating. It can be processed on the same equipment and press cycles as standard FR4, making it significantly easier and faster to fabricate — with no penalty on Dk stability or Df performance up to 12 GHz.
RO4350B Material Properties
| Property | Value | Test Condition |
|---|---|---|
| Dielectric Constant (Dk) | 3.48 ± 0.05 | 10 GHz, IPC-TM-650 2.5.5.5 |
| Dissipation Factor (Df) | 0.0037 | 10 GHz, IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of Dk (TCDk) | +50 ppm/°C | –50 to +150°C |
| CTE (x, y axis) | 14 ppm/°C | IPC-TM-650 2.4.41 |
| CTE (z axis) | 32 ppm/°C | IPC-TM-650 2.4.41 |
| Thermal Conductivity | 0.69 W/m/K | ASTM C518 |
| Tg (Glass Transition) | >280°C | TMA |
| Flame Retardant | UL 94 V-0 | — |
Available Thicknesses
RO4350B is available in the following standard dielectric thicknesses (not including copper foil):
0.101 mm / 0.168 mm / 0.254 mm / 0.338 mm / 0.422 mm / 0.508 mm / 0.762 mm / 1.524 mm
For controlled impedance designs, 0.254 mm and 0.508 mm are the most commonly used cores. Custom thicknesses are available on request.
RO4350B vs Other Rogers Materials
| Material | Dk | Df | Type | Best For |
|---|---|---|---|---|
| RO4350B | 3.48 | 0.0037 | Hydrocarbon ceramic | 1–12 GHz, 5G sub-6GHz, WiFi, antenna |
| RO4003C | 3.38 | 0.0027 | Hydrocarbon ceramic | Lower loss than RO4350B, same process |
| RO3003 | 3.0 | 0.0010 | PTFE ceramic | Ka-band, 77 GHz, above 20 GHz |
| RT5880 | 2.20 | 0.0009 | PTFE glass | EW 2–18 GHz, wideband, lowest loss |
RO4003C is the lower-loss alternative within the same hydrocarbon ceramic family — same FR4-compatible process, lower Df. See RO4003C vs RO4350B for a detailed comparison. For applications above 20 GHz, PTFE materials (RO3003, RT5880) are required.
Stackup Design for RO4350B
2-Layer RO4350B (most common for RF modules)
- Top copper: 1 oz (35 µm) finished
- RO4350B core: 0.254 mm or 0.508 mm
- Bottom copper: 1 oz (35 µm) finished
- Total board thickness: ~0.36 mm or ~0.62 mm
For 50Ω microstrip on 0.254 mm RO4350B with 1 oz copper: trace width approximately 0.56 mm. For 0.508 mm core: trace width approximately 1.14 mm. Confirm with your fabricator’s impedance calculator before finalizing layout.
4-Layer Hybrid Stackup (RO4350B + FR4)
- L1 signal — RO4350B 0.254 mm core
- L2 ground plane
- FR4 prepreg
- L3 power plane
- FR4 prepreg
- L4 signal — RO4350B 0.254 mm core
This stackup places RF signal layers on RO4350B while using FR4 for internal power and ground planes, reducing material cost significantly. See FR4 + Rogers hybrid PCB stackup guide for detailed design rules.
Manufacturing Requirements
Drilling
Standard mechanical drill parameters. No plasma activation required — key advantage over PTFE PCB materials. Minimum drill diameter 0.2 mm standard, 0.1 mm with laser.
Lamination
Standard FR4 press cycle compatible. For RO4350B + FR4 hybrid stackups, Rogers 4450F bondply is recommended as the prepreg between Rogers and FR4 layers.
Surface Finish
ENIG (immersion gold) is standard for RF applications. Immersion silver is acceptable for lower-cost prototypes. HASL is not recommended above 3 GHz due to surface flatness variation.
Controlled Impedance
±10% standard, ±5% available with TDR verification. Minimum line width 2.5 mil. Impedance tolerance must be specified on the fabrication drawing.
Copper Foil
Standard electrodeposited copper foil for most applications. For frequencies above 10 GHz, low-profile or reverse-treated copper foil reduces insertion loss from surface roughness.
Applications
- 5G sub-6GHz RF front-end modules and filters
- WiFi 6 and WiFi 6E access point PCB
- Antenna PCB for 2.4 GHz, 5 GHz, and 6 GHz
- Radar front-end PCB at 24 GHz
- Satellite communication ground equipment below 12 GHz
- Power amplifier PCB for cellular base stations
- FR4 + Rogers hybrid stackups for mixed RF/digital designs
Conclusion
RO4350B is the right choice for most RF and lower microwave applications below 12 GHz. Its combination of stable Dk, low Df, FR4-compatible processing, and broad thickness availability makes it the default starting point for Rogers PCB design. For applications above 20 GHz or where insertion loss budget is critical, evaluate RO4003C (same process, lower Df) or PTFE materials (RO3003, RT5880).
Order RO4350B PCB from a Direct Factory
Riching PCB stocks Rogers RO4350B in all standard thicknesses. Send the following for DFM review and quotation:
- Gerber files + NC drill file
- RO4350B core thickness and copper weight per layer
- Stackup drawing — single material or FR4 hybrid
- Controlled impedance requirements
- Quantity and required lead time
WhatsApp +86 13760473650 — prototype lead time 5–7 working days
Request a PCB Quote
Upload your Gerber ZIP file and project requirements. Our engineering team will review your PCB material, stackup, impedance needs, surface finish, and production quantity before quoting.
Please prepare:
- Gerber files in ZIP format
- PCB material or stackup requirements
- Controlled impedance notes if available
- Prototype or batch production quantity