Rogers FR4 Hybrid PCB Design Guide — Bonding Film Selection, Lamination Cycles and Cost Optimization A Rogers FR4 hybrid PCB combines Rogers RF material on the layers that carry RF signal with standard FR4 on digital, power and ground layers…
Rogers Raw Material Surcharge August 2026 — Which Materials Rose and By How Much Rogers Corporation notified customers on July 31, 2026 of a Raw Material Surcharge (RMS) taking effect August 3, 2026, applying to purchase orders for China-manufactured Rogers…
Rogers RO3003 PCB: Ka-Band, 77 GHz and Defense Applications Guide Rogers RO3003 is the standard PTFE ceramic substrate for Ka-band (26.5–40 GHz), 77 GHz automotive radar, and high-via-density defense RF applications including AESA arrays and missile seekers. Its combination of…
Microstrip vs Stripline PCB — Loss, Isolation and When Each Structure Wins Microstrip and stripline are the two fundamental transmission line structures used in RF PCB design — the choice between them affects insertion loss, EMI shielding, trace width, and…
Blind and Buried Via RF PCB Design — Lamination Cycle Limits and When to Use Each Blind and buried vias solve the via stub problem by eliminating the unused via barrel entirely, rather than shortening it as backdrill does. But…
F4B PCB Material Guide — F4BM220 to F4BTM615 Dk/Df Data and Thickness Options F4B is a PTFE-based RF laminate family produced by Wangling (泰兴旺灵), spanning low-Dk low-loss grades (F4BM220) through mid-Dk general RF grades (F4BM300, F4B350) to high-Dk miniaturization grades…
